Since the beginning of the mobile phone industry, handset manufacturers have been working on ways to reducing the thickness of chip packaging, achieve greater integration and cut manufacturing costs. Amongst numerous approaches, PoP1 technology has been massively adopted for smartphones and tablets to make a stack containing the application processor and DRAM.
This year, Apple went further, with a new wafer-level PoP solution based on TSMC technology, called ‘integrated Fan-Out PoP’ or inFO-PoP. This announcement has strongly affected the advanced packaging industry. A new day has come, where fan-out platforms will play the leading role, bringing significant changes to the value and supply chains. You can look deep inside Apple’s technology with the help of System Plus Consulting, sister company of Yole Développement (Yole), in its latest reverse engineering analysis of theApple A10 inFO-PoP.