ASE licenses Deca’s M-Series™ Fan-out Wafer-Level Packaging technology; agreement expands the manufacturing of miniaturized semiconductor packages for smartphones and IoT.
Advanced Semiconductor Engineering and Deca Technologies, a subsidiary of Cypress Semiconductor announced the signing of an agreement whereby ASE will invest $60 million in Deca and will license Deca’s M-Series™ Fan-out Wafer-Level Packaging (FOWLP) technologies and processes.
As part of the agreement, ASE and Deca will jointly develop the M-Series fan-out manufacturing process and will expand production of chip-scale packages using this technology. The technology is required for the reduced size and power consumption needed for portable Internet of Things (IoT) applications and smartphones. Deca’s version of it uses autoline technology developed by SunPower to decrease cost and manufacturing cycle time.
“At Cypress we have experienced the efficiency of Deca’s M-Series technology with our own chips and brought its benefits to our customers,” said T.J. Rodgers, Chairman of the Board at Deca Technologies and president and CEO of Cypress Semiconductor “With this investment from ASE, Deca now has strong validation of M-Series as a technology that will bring fan-out wafer-level packaging to mass production. This deal is a significant proof point for Deca and for Cypress’s ongoing strategy of investing in startups as part of our Emerging Technologies Division.”
The ability to put more functionality on ever-shrinking semiconductors, also known as Moore’s Law, is causing an unintended consequence in the semiconductor packaging industry, where chips using advanced silicon technologies are so small that all of the input and output balls cannot fit on the surface of the chip using conventional wafer-level chip-scale packaging (WLCSP) technology. Deca’s M-Series addresses this challenge with a FOWLP approach, where very small silicon chips are embedded into a larger plastic chip, and the CSP balls are redistributed onto both the native silicon chip and the expanded plastic chip. M-Series enables industry-leading manufacturability for FOWLP using Deca’s proprietary Adaptive Patterning™ technology, which tracks the alignment of each silicon IC in the redistributed plastic package. ASE has found M-Series to be a viable and effective high-volume manufacturing FOWLP solution.
“With the increasing demands to improve performance and reduce package size from the smartphone market and the emerging demand for IoT, the industry has been looking for a FOWLP technology with true manufacturability,” said Chris Seams, CEO of Deca Technologies. “Deca is excited to have ASE select our patented M-Series technology to meet this challenge. By leveraging ASE’s large customer base and world-class manufacturing expertise, we can bring FOWLP processing to high-volume reality.”
Deca’s fan-out wafer level packaging technologies will add to ASE’s advanced packaging portfolio, providing customers with a more diverse selection of offerings that are best suited for their IC designs. “Announcement is a major milestone in ASE’s FOWLP roadmap and demonstrates ASE’s continued pursuit in industry leadership to build a complete manufacturing eco-system with key partners,” said Dr. Tien Wu, COO, ASE Group. “The incorporating of Deca’s M-Series and Adaptive Patterning technologies and manufacturing process will enable ASE to offer customers a proven FOWLP solution that is cost-effective due to the efficiency of large-panel-based processing.”
The proposed investment by ASE is subject to the various regulatory approvals or consents including but not limited to the approvals of the Taiwan government.
Source: http://www.decatechnologies.com
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