真乄科技業的頂尖投資團隊

From Dr. Phil Garrou for Yole Développement - At the recent Confab Conference in Las Vegas , Kevin Tran, Sr. Marketing Mgr. of Hynix, announced that they had qualified high bandwidth memory (HBM) for “mass production” in March and that “HBM2 design wins were in progress in multiple market segments”. iMicronews thought this was worth… A closer look.

Tran noted that packaging technology has become the key enablement for high performance, small form factor memory solutions. While applications have different memory requirements, most common are high bandwidth and density.

Application Requirements for Memory

HBM utilizes a combination of many more connections (short TSVs) to overcome DRAM bandwidth challenges.

Banwidth Challenges Overcome by TSV

HBM reduces power consumption and increases power efficiency.

HBM Reduces Power Consumption

Second generation HBM2 will come in 8 core, 4 core and 2 core configurations with 1024 I/O each able to supply 128 to 256 Gb bandwidth as shown in the table below.

HBM2 Product Configurations

Hynix projects that the high memory density with high bandwidth for server applications will require DDR4 3DS technology with TSV (3DS = 3D stacking). They project that past 2020 this will become the dominant server technology.

DDR4 3DS for High End Servers

In the future they expect cost reduction to come from “productivity improvements, advances in equipment and test time reduction”.


Source : www.yole.fr