2014年5月27日，北卡羅來納州三角研究園- Ziptronix公司與電動汽車集團（簡稱“ EVG公司” ）今日宣布已成功地在客戶提供的300毫米DRAM晶圓實現亞微米鍵合後對準精度。方法是在EVG雙子座® FB的產品融合鍵合機和的SmartView ® NT的鍵合對準機上採用Ziptronix的DBI ®混合鍵合技術。這種方法可用於製造各種應用的微間距3D集成電路，包括堆棧存儲器、高級圖像傳感器和堆棧式系統芯片（ SoC）的。
Ziptronix的首席技術官兼工程副總裁保羅恩基斯特表示： “ DBI混合鍵合技術的性能不受連接間距的限制，只需要可進行測量的適當的對準和佈局工具，而這是之前一直未能解決的難題。EVG的融合鍵合設備經過優化後實現了一致的亞微米鍵合後對準精度，此對準精度上的改進為我們的技術的大批量生產（ HVM ）鋪平了道路。 “
新一代3D技術的間距測量預計將會持續多年。微間距混合鍵合已應用於高性能的3D內存產品，並已宣布大批量生產3D圖像傳感器。 DBI混合鍵合可用在晶粒或晶圓級；然而，晶圓級鍵合通過一次鍵合所有晶粒實現了巨大的成本優勢。由於大部分DBI混合鍵合在晶圓級進行處理，故具有低總擁有成本的優勢。
EVG的執行技術總監保羅·林德納表示：“亞微米精度對於在更廣泛應用的大批量生產中實現微間距連接是至關重要的。隨著行業推動3D集成電路的發展，我們與Ziptronix聯合開發生產方案，共同努力為客戶提供驚人的附加價值。 “
Ziptronix直接鍵合互連（ DBI ® ）混合鍵合是一種導體/電介質鍵合技術，包括各種金屬/氧化物和/或氮化物的組合，不需使用粘合劑，是目前市場上最合適量產的技術。此技術能夠對銅/銅或其他金屬鍵合實現強力、常溫絕緣鍵合、低溫導電鍵合和微間距互連，因為在絕緣和導電錶面之間均進行鍵合，故能有效鍵合整個襯底界面區域。
EVG用於通用對準的的SmartView ®NT自動鍵合對準系統提供了一種晶圓級的面與面之間對準的專有方法，這是在多晶圓堆疊中達到先進技術所需精度要求的關鍵。除了改善的SmartView ® NT的鍵合對準機的對準功能以達到亞微米級的精度， EVG進行優化，使得表面可以同時為鍵合，電氣連接性和機械強度做好準備。
公司將於2014年5月27-30日在佛羅裡達州布納維斯塔湖舉行的2014年電子元件與技術會議（ ECTC 2014年）上展出這項技術。要了解更多有關Ziptronix DBI的混合鍵合的信息，請參觀121號展位，若要了解更多有關EVG融合鍵合設備解決方案的信息，請參觀413號展位。
Ziptronix簡介
Ziptronix是開發低溫直接鍵合技術的先驅，提供晶圓或芯片級鍵合的專利技術。其ZiBond ®直接鍵合和DBI ®混合鍵合技術為3D堆疊提供業界最具擴展性和可製造性、且總體擁有成本最低的解決方案。該公司的知識產權已授權用於多種半導體應用，包括BSI傳感器、射頻前端、微型投影機、存儲器和3D集成電路。公司作為美國北卡三角洲國際研究院募資的衍生公司成立於2000年，至今已發布了超過40項美國專利，國際專利則超過35項，目前有超過50個美國和國際專利正在申請中。 www.ziptronix.com 。
電動汽車集團（ EVG ）簡介
電動汽車集團（ EVG ）是半導體，微機電系統(MEMS)、化合物半導體、功率器件和納米技術設備製造領域領先的設備和工藝解決方案供應商。主要產品包括晶圓鍵合、薄晶圓加工、光刻/納米壓印光刻（NIL ）和計量設備，以及光阻塗佈機，吸塵器和檢測系統。電動汽車集團成立於1980年年，為複雜的全球客戶網絡和世界各地的合作夥伴提供服務和支持。若要了解更多有關EVG的信息，請訪問www.EVGroup.com 。
Ziptronix Inc. and EV Group ("EVG") announced they have successfully achieved submicron post-bond alignment accuracy on customer-provided 300mm DRAM wafers. The results were achieved by implementing Ziptronix's DBI® Hybrid Bonding technology on an EVG Gemini® FB production fusion bonder and SmartView®NT bond aligner. This approach can be used to manufacture fine-pitch 3D ICs for a variety of applications including stacked memory, advanced image sensors and stacked systems-on-chip (SoCs).
"The performance of DBI Hybrid Bonding technology is not limited by connection pitch, but requires the right alignment and placement tool with an ability to scale that has been a challenge to find until now," said Paul Enquist, CTO and VP Engineering at Ziptronix. "EVG's fusion bonding equipment has been optimized to achieve consistent submicron post-bond alignment accuracy. This advancement in alignment accuracy provides a clear path to high-volume manufacturing (HVM) of our technology."
Pitch scaling on next-generation 3D technologies is expected to continue for many years to come. Fine-pitch hybrid bonding is already in use in high-performance 3D memory products, and has been announced for HVM of 3D image sensors. DBI Hybrid Bonding can be used at the die or wafer level; however, wafer-level bonding enables a great cost benefit by bonding all the die at once. With much of the processing for DBI Hybrid Bonding taking place at wafer scale, there is the added benefit of low cost-of-ownership.
"Demonstrating submicron accuracy is critical to achieving fine-pitch connections in HVM for a wider variety of applications," said Paul Lindner, Executive Technology Director at EVG. "As the industry pushes to realize 3D ICs, joint efforts such as our work with Ziptronix to develop manufacturing approaches offer customers a tremendous value-add."
Ziptronix Direct Bond Interconnect (DBI®) Hybrid Bonding is a conductor/dielectric bonding technology that includes a variety of metal/oxide and/or nitride combinations, does not use adhesives and is currently the most suitable for volume manufacturing in the marketplace. It allows for strong, room temperature dielectric bonding, low temperature conductive bonding and finer-pitch interconnect over Cu/Cu or other metal bonding because the bond occurs between both the dielectric and the conductive surfaces, which effectively bonds the entire substrate interface area.
EVG's SmartView®NT Automated Bond Alignment System for Universal Alignment offers a proprietary method of face-to-face wafer-level alignment, which is key to achieving the required accuracy in multiple wafer stacking for leading-edge technologies. In addition to improving alignment capabilities on its SmartView®NT bond aligner to reach submicron accuracies, EVG has optimized it so that surfaces can be prepared simultaneously for bonding, electrical connectivity and mechanical strength.
The companies will showcase this technology at ECTC 2014, from May 27-30, 2014, in Lake Buena Vista, Florida.
Sources :
http://www.evgroup.com
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