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國際半導體設備材料協會(SEMI)公布,2012年6月北美半導體設備製造商接單出貨比(Book-to-Bill ratio)初估為0.94,為5個月以來首度低於1。

6月SEMI半導體設備BB值0.94,也創下2011年12月以來新低,並且是連續第3個月呈現下滑,跌破1恐暗示景氣轉弱,1為景氣擴張或是衰弱的分水嶺。0.94意味著當月每出貨100美元的產品僅能接獲價值94美元的新訂單。

SEMI表示,6月北美半導體設備製造商接獲全球訂單的3個月移動平均金額為14.556億美元,創3月以來新低,較5月上修值16.137億美元下滑9.8%,較2011年同期的15.4億美元下滑5.5%。6月北美半導體設備製造商3個月移動平均出貨金額初估為15.549億美元bb  ,較5月上修值15.393億美元上揚1.0%,但較2011年同期的16.4億元短少5.2%。

North American Semiconductor Equipment Industry Posts June 2012 Book-to-Bill Ratio of 0.94

SAN JOSE, Calif. — July 19, 2012 — North America-based manufacturers of semiconductor equipment posted $1.46 billion in orders worldwide in June 2012 (three-month average basis) and a book-to-bill ratio of 0.94, according to the June Book-to-Bill Report published today by SEMI.  A book-to-bill of 0.94 means that $94 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in June 2012 was $1.46 billion. The bookings figure is 9.8 percent lower than the final May 2012 level of $1.61 billion, and is 5.5 percent lower than the June 2011 order level of $1.54 billion.

The three-month average of worldwide billings in June 2012 was $1.55 billion. The billings figure is 1.0 percent more than the final May 2012 level of $1.54 billion, and is 5.2 percent less than the June 2011 billings level of $1.64 billion.

“Following seven months of increases, the three-month average bookings declined in June and likely reflects some slowing in investment plans attributed to weaknesses in the broader economy,” said Denny McGuirk, president and CEO of SEMI.  "While order activity may slow, equipment spending this year will continue to be directed towards advanced technologies in wafer processing and packaging assembly.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

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