Amkor had introduced a new, state-of-the-art fan-out structure called Silicon Wafer Integrated Fan-out Technology (SWIFT™) to bridge the gap between TSV and traditional WLFO/FOWLP packages. SWIFT technology is designed to provide increased I/O and circuit density within a reduced footprint and profile for single & multi-die applications. The distinctive characteristics of SWIFT technology are due, in part, to the fine feature capabilities associated with this innovative wafer-level packaging technique. This allows much more aggressive design rules to be applied compared to traditional WLFO and laminate-based assemblies. In addition, SWIFT technology enables the creation of advanced 3D structures that address the need for increased IC integration in emerging mobile and networking applications.
SWIFT™ Structure and Attributes
The figure below shows cross-section illustrations of a single die SWIFT and dual-die 3D/Package-in-Package (PoP) SWIFT structures. Although the package appears to be of a typical fine-pitch flip chip construction, it incorporates some unique features not associated with conventional IC packages.
These unique SWIFT features include:
- Polymer-based dielectrics
- Multi-die and large die capability
- Large package body capability
- Interconnect density down to 2 μm line/space (critical for SoC partitioning applications)
- Cu pillar die interconnect down to 30 μm pitch
- 3D/Package-on-Package capability utilizing Thru Mold Via (TMV®) or tall Cu pillars
- Meets JEDEC MSL3 CLR and BLR requirements
SWIFT™ Enabling Technologies
Key assembly technologies enable the creation of these distinctive SWIFT features and attributes. Through the use of stepper photo imaging equipment, 2/2 μm line/space features can be achieved, enabling very high density die-to-die connections required for SoC partitioning and networking applications where 2.5D TSV would typically be used. Fine-pitch die micro bumps provide a high-density interconnect for advanced products, such as application processors and baseband devices. In addition, tall Cu pillars enable a high density vertical interface for mounting advanced memory devices on the top of the SWIFT structure.
SWIFT™ Process Flow
These SWIFT™ attributes are realized by applying a unique process flow that incorporates both flip chip assembly and wafer-level processing techniques, as shown below.
SWIFT™ Technology Process Flow
Advanced Wafer Product Positioning
For more information on Silicon Wafer Integrated Fan-out Technology (SWIFT), please contact an Amkor Regional Sales Office near you or fill out the Request Form.
Source:http://www.amkor.com/go/technology/swift
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