真乄科技業的頂尖投資團隊

雖然物聯網(IoT)及4G LTE議題仍不斷炒熱IC半導體產業，但受限於個人電腦與行動裝置銷售不如預期，2015年的IC半導體產值透露輕微寒意；TrendForce旗下拓墣產業研究所最新報告顯示，1995年到2014年間，上半年與前年的同期增比發生下滑的情形出現過六次，除了2013年全年產值年增微幅上升1.9%外，其餘五年產值年增率均呈現衰退。

在消費者年度消費偏好沒有明顯改變下，拓墣預估2015年IC半導體產業(不含記憶體)產值難有高度成長，上下半年產值比約為46:54，全年產值2041億美元，僅小幅成長3.1%。

The Lithography market has been a quite established business in the last 10 years, especially for More Moore markets, with a domination of ASML and its disintegrated supply chain model, compared to Canon and Nikon.
But the More Than Moore applications are telling us a complete different story. As described in the new report from Yole Développement (Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED Applications.), the photolithography market for advanced packaging Mems and LED manufacturing will almost double in units between 2014 and 2020, with very important market opportunities in advanced packaging and MEMS.

But as the supply chain for such applications is more fragmented compared to More Moore applications and roadmaps are also extremely complex, we have interviewed Mr. Ralph Zoberbier, General Manager Exposure and Laser Processing at SUSS MicroTec, a leading lithography equipment provider in the market for MEMS, advanced packaging and compound semiconductors, in order to understand their vision of the evolution of the industry and what it means to be part of the More Than Moore revolution(s)…


Yole Développement: Can you introduce SUSS MicroTec’s product line in lithography market, its history and current activity?
Ralph Zoberbier: Over the last years, SUSS MicroTec developed its product portfolio to a full set of complimentary lithography technologies, including proximity printing, projection lithography, nanoimprint lithography and excimer laser ablation. Initially the company developed and provided mask aligners for decades. New and emerging applications in our target markets demanded different features and capabilities beyond the aligner and are driving the continuous expansion of our product and technology portfolio. 
Target markets and applications are in the area of advanced packaging, MEMS, III-V semiconductors such as LEDs and academia. With the latest extension of the technology portfolio SUSS MicroTec could gain business traction also in new markets such as flexible electronics and medical applications.
Total revenue of the company - SUSS MicroTec concluded the 2014 fiscal year with a revenue of 145.3 million.

YD: Which market(s) and applications mainly drive(s) SUSS MicroTec’s revenue today? 
RZ: The most important market segments of SUSS MicroTec are advanced packaging and MEMS applications. Key industry drivers are the continuous market growth of consumer electronics such as smartphones and the IoT, including all kinds of sensors and communication devices.

YD: What are the competitive advantages of your products? What applications does SUSS MicroTec target?
RZ: The major advantage of SUSS mask aligners is based on the unique exposure optics technology (MO Exposure Optics) and its precise overlay capabilities. They are known as very mature and reliable equipment that are widely used in all market segments. The new projection scanner technology of SUSS MicroTec promises to be the lowest-cost projection technology, mainly targeting 300mm packaging applications. Looking at our laser ablation technology, one has to understand that this disruptive technology enables the use of non-photo dielectrics in packaging applications that requires higher mechanical and thermal stability. Laser ablation is therefore currently evaluated in packaging applications but already an established technology in the manufacturing of flexible electronics and medical devices.

YD: How do you see the evolution on the markets you are involved in for the coming years?
RZ: Main changes are expected to happen in the area of advanced packaging. New materials but also new packaging platforms and technologies such as fan out wafer level packaging are driving the development of dedicated equipment sets to meet the technical requirements but also the cost targets. E.g. in a few years high volume panel processing solutions will be required in applications that typically dealt with wafer scale up to 300mm only so far.

YD: What will be for you the major evolutions of the lithography business in the coming years?
RZ: The main promising areas of growth for SUSS MicroTec are expected to be for our new projection lithography solutions and laser ablation. However these growth technologies are targeting market segments with very high level of competition. 

YD: What is the status of SUSS MicroTec in Advanced Packaging, MEMS devices and LED and what changes do you expect in the future? 
RZ: There is a long and a short answer for this. In a nutshell: SUSS MicroTec was able to build up a very strong market position in MEMS and LED applications. With the continuous development and improvements on the SUSS mask aligners, SUSS MicroTec will maintain or even expand this position, furthermore SUSS MicroTec is established as a leading equipment provider in advanced packaging applications. Especially with its new technologies and toolsets SUSS MicroTec targets to further increase market share in this area. 



YD: What is the most promising lithography equipment for Advanced Packaging, MEMS and LED devices? Why?
RZ: There is no single lithography solution that fits best to all applications. The broad range of resolution and overlay requirements, substrate format and sizes and desired cost structures cannot be covered by one single patterning technology. The process engineer needs to carefully compare technical compatibility with technical and commercial requirements. 

YD: According to you, what are the main technical challenges for lithography in the packaging, MEMS & LED area and how is SUSS MicroTec addressing them?
RZ: On one hand the main technical challenge is the ever increasing requirements on feature sizes and overlay performance in combination with increasing cost sensitivity in the target markets. On the other hand application specific challenges are typically related with the substrate size and thickness. Very strong wafer warpage, unevenness and stiffness are typical challenges that impact the lithography performance and finally the yield. 
SUSS MicroTec continuously develops new features, such as special optics and new substrate handling methodologies to meet these challenges in a cost-efficient way….

YD: What are for you the main critical process steps in the packaging, MEMS devices and LED?
RZ: One of the key challenge is the decrease of feature size. Overlay becomes critical due to the increased complexity of the More Than Moore devices. The market push for lithography equipment at 2µm features in the next years is strong and is a key trend that SUSS MicroTec is taking into account in its strategy in the new equipment development. SUSS MicroTec has created a portfolio with multiple lithography technologies in order to be able to adapt its offer to the needs of the market.

YD: For which advanced packaging platform do you expect a high growth for the next few years for further investment in lithography tools? Why?
RZ: Besides the already mentioned investments in Fan-out and Flip-chip applications, we expect a significant transition from 200mm to 300mm in CIS packaging and a strong need for lithography equipment in panel applications such as 2.5D interposer, embedded die and panel fowlp.

YD: What are the main end-applications that will drive the next growth of these different platforms? 
RZ: Clearly, smart phones, IoT and wearable electronics are the drivers.

YD: What is your analysis of the lithography competitive landscape?
RZ: The competitive landscape changed a lot over the last 5 years. There are only a few mask aligner technology providers active in the market but many new players are entering the projection lithography segment. In addition laser direct imaging or laser write technologies are emerging and have great potential to become another relevant patterning technology.

YD: We have seen lithography equipment suppliers coming from the PCB manufacturing area willing to enter the lithography market with disruptive technologies: what are the challenges for SUSS MicroTec? How will SUSS MicroTec compete against the leaders?
RZ: We are taking this change in the competitive landscape very seriously and are preparing accordingly. As of today LDI technology is either limited in its resolution capability or does not yet provide the required throughput capability for HVM. However, that will most likely change over the next years as computing power and laser energy will improve.



YD: You have 2 disruptive technologies in your lithography systems portfolio, namely Nanoimprint lithography and Laser ablation Can you tell us more on the applications you target, the roadmap you envisage for these technologies?
RZ: We clearly see nanoimprint technology evolving from a pure research technique into production applications. Main application fields are in the area of HB LED, Photovoltaics, MEMS, NEMS and optical gratings e.g. for gas sensing. With this change the market requires dedicated automated equipment. Nanoimprint needs a lot of adaptation in order to reach the right level of process stability, repeatability, yield…
The biggest opportunity for laser ablation is in patterning of non-photo dielectrics. The ever increasing requirement of higher performance packages is driving the need for better dielectric materials. Non-photo dielectrics provide the desired mechanical and thermal capabilities for high performance packages but could not be processed cost efficiently so far. These polymers can now be processed with the excimer laser ablation stepper and meet cost targets and industry roadmap requirements. 

YD: How do you see the evolution of these disruptive and alternatives lithography technologies in the lithography market?
RZ: As described above, these disruptive/alternative lithography technologies will co-exist with already established and mature systems.
If you are looking from an external point of view to the technologies available, mask aligners are by far the technology providing the lowest COO, throughput and lowest capex (factor 2-4 compared to a stepper…) in the industry for a specific demand. So the move to stepper will only be done if the mask aligners are not adapted in terms of specifications.
In advanced packaging, the manufacturing of copper pillar for FC, several of the FO platforms may need steppers as the overlay can be below 1µm. So here only, the stepper is the technical answer, but at very high price.
When it comes to new technologies like LDI and Laser Write Technology, they either provide good throughput OR the ability to reach desired feature sizes, but not both at the same time yet. In these cases, still specific development of laser and laser management systems is required. Time and investment is needed in order to deliver the right solution.

YD: In order to reduce cost, the industry is currently working on developing a panel infrastructure based. Will SUSS MicroTec be able to support panel based infrastructure? And if yes, can you comment on your level of readiness and for which of your products? 
RZ: SUSS MicroTec will definitely support the industry with panel capable technologies and equipment. So far SUSS MicroTec already provides a projection scanner and laser ablation products for panel processing.

YD: What are the next steps for SUSS growth in this lithography industry?
RZ: SUSS MicroTec continues to focus on its lithography product line and to contribute to the advancements of next-generation technologies. We are continuously working on new products and technologies to increase our market position in target applications mentioned above. An important factor for succeeding in our work is the close collaboration with our partners, like materials suppliers, research institutes and of course, our key industrial customers. Another factor that forms the key to SUSS MicroTec’s strength is our strong portfolio - we own the entire lithography process knowhow and offer complete lithography solutions that include coat/bake, develop, and patterning.


Biography: 

Ralph Zoberbier graduated in Precision Engineering and Microsystems Technology from the University of Applied Sciences in Nuremberg. He joined SUSS MicroTec in 2001 as R&D Project Manager. In 2005 he became International Product Manager Aligner. From 2010 – 2014, he led the Aligner Product Management team as Director Product Management. With the acquisition of Tamarack Scientific Inc., his responsibility was extended by complementary projection lithography and laser process technology. In 2014 he was appointed to General Manager Exposure and Laser Processing. Ralph gained his MBA degree in Entrepreneurship at Louisville University, Kentucky.

人稱「蔣爸」且兩度退休的台積電（2330）董事長顧問蔣尚義昨獲選為新任工研院院士，蔣尚義昨透露，過去每年回台4次、每次2周，但今年上半年有一半時間在台灣，主要是董事長張忠謀「交代一些特別的事給我」，他強調，台積電下一個目標就是要把7奈米做到全世界最領先。

智慧裝置不斷推陳出新，驅動半導體製程加速演進，然而鰭式電晶體(FinFET)從10奈米微縮至7奈米時，漏電問題將更為嚴重，成為一大技術關卡；比利時微電子研究中心(IMEC )已透過改善寄生效應的方式克服此一挑戰。

智慧裝置推陳出新，其相關晶片和製程需求日漸成長，其中鰭式電晶體微縮亦成為重要課題。鰭式電晶體從10奈米微縮至7奈米，將遭遇諸多技術問題，譬如寄生效應紛紛浮出水面，鰭式電晶體微縮應首重改善寄生效應，進而減少漏電情形。

中國內地集成電路晶圓代工企業—中芯國際集成電路製造有限公司，與全球領先的信息和通信解決方案供應商華為、微電子研究中心之一比利時微電子研究中心（imec）、國際無晶圓半導體廠商Qualcomm Incorporated的附屬公司Qualcomm Global Trading Pte. Ltd.在京簽約，宣布共同投資中芯國際集成電路新技術研發（上海）有限公司，開發下一代CMOS邏輯工藝。

中芯國際集成電路新技術研發（上海）有限公司由中芯國際控股，華為、imec、Qualcomm各佔一定股比。目前以14納米先進邏輯工藝研發為主。

中國最大晶圓代工廠中芯國際（SMIC）23 日宣布，將與美國行動晶片巨擘高通、比利時半導體技術研發機構 IMEC，以及華為共同成立新研發公司，希望以夷制夷快速縮小與台積電、英特爾與三星等國際競爭對手的技術差距，並早日實現中國芯的戰略目標。

SMIC 與高通的合作尤其引人注目，因為這對雙方在開發中國市場來說可謂互蒙其利。對 SMIC 而言，除可加快獲得新半導體技術外，未來高通還可能擴大對 SMIC 釋單。另一方面，高通去年遭中國反壟斷調查，加強與中國廠合作剛好可修補高通在中國的政商關係。

自從2008~2009年的全球經濟衰退以來，IC產業就致力於淘汰舊產能(例如8吋晶圓廠)，以專注於生產更具成本效益的較大尺寸晶圓；根據市場研究機構IC Insights的統計，在2009~2014年間，全球半導體製造業者總計已經關閉或改裝83座晶圓廠。

下圖顯示自2009年以來關閉的晶圓廠中，有41%是6吋晶圓廠，27%是8吋晶圓廠；奇夢達(Qimonda)是第一家關閉一座12吋晶圓廠的半導體業者，原因是該公司在2009年結束營業。而在2013年，台灣記憶體業者茂德(ProMOS)與力晶(Powerchip)也分別關閉了一座12吋晶圓廠。 

從連接到全球化和可持續發展等方面來看，戈登·摩爾(Gordon Moore)預測半導體技術的演進步調已為全球技術創新和貢獻了50年。摩爾定律預測的進步指數已改變我們生活的世界，持續的創新、發明和技術投資的成果，這都源自於摩爾定律使半導體的進展沿著相同的路徑在未來繼續前進。IHS最新的報告「慶祝摩爾定律50周年(Celebrating the 50th Anniversary of Moore’s Law)」介紹了如何透過摩爾定律預言的演進，不僅推動技術變革，而且也創造巨大的經濟價值，並推動社會進步。 

1965年4月，快捷半導體(Fairchild Semiconductor)研發總監戈登·摩爾，這位後來創立英特爾(Intel)傳奇人物寫下一篇文章，提出晶體管降低成本並以指數速率提高性能的觀察。他更假定每18~24個月，大約兩倍數量的晶體管可被合併到單個晶片中。而這一開創性的觀察，後來被稱為「摩爾定律」。 

“企業界的一條腿被政府砍斷了”，偉詮電董事長林錫銘拿出預先擬好的稿子，在台灣半導體產業協會今年年會上大吐苦水。

員工分紅費用化，加上證所稅，讓員工失去長期持有公司股票的意願，許多上市櫃公司價值被低估，林錫銘說，“很多公司可能會被委屈併購”。

半導體供應鏈正面臨越來越多的挑戰，但10nm節點將有更大的機會能夠從新技術製程的微縮中獲得更大的好處。

根據國際商業策略(IBS)的分析預計，20nm和16/14nm製程的閘極成本將會比上一代技術更高。而針對10nm閘極成本的分析則顯現出不同的模式，如下圖所示。 

身為記者，我有時候會需要經過一系列的資料收集──通常包含非正式評論、隨機事實(random facts)、推特文章、研討會/座談會資料或是公關宣傳稿，然後才能把許多線索串聯在一起；全空乏絕緣上覆矽(Fully depleted silicon-on-insulator，FD-SOI)就是一個例子。

我從美國旅行到中國接著又到歐洲，在與電子產業人士討論技術的過程中，發現FD-SOI從一個不容易了解的名詞，逐漸變得越來越「有形」。關於這個技術，我在最近這幾個星期所收集到的隨機事實包括：

根據德意志銀行(Deutsche Bank)的分析報告， 2015年第二季全球市場對半導體元件的需求持續疲弱，主因是部分亞洲PC組裝業者表示，部分零組件的採購量與 2014年同季相較，減少了15~20%；不過在近五年拜訪了近30家台灣、韓國與日本業者的該銀行分析師指出：「iPhone供應鏈與汽車市場仍然是表現亮眼。」

德意志銀行的報告也顯示，平板電腦、電視以及許多Android手機的晶片需求亦呈現衰弱，該銀行對整體晶片產業領域發展的評等為中性。「在中國智慧型手機業者中，只有華為(Huawei)與小米(Xiaomi)依舊表現傑出；」該報告指出：「三星(Samsung)仍在中低階手機市場掙扎，但是Galaxy S6與S6 Edge合計可在今年達到可觀的4,500萬支出貨量。」