Yole Développement（以下簡稱Yole）有機會採訪了Heptagon公司銷售與市場部高級副總裁Rene Kromhof。Yole在許多研究報告中都涉及了成像市場和技術，包括《攝像頭模組產業-2015版》和《2015年攝像頭模組拆解回顧》。
我們最新的報告《無人機和機器人傳感器-2016版》（將於2016年3月發布）完美地契合了Heptagon公司最新發布的基於飛行時間測量（ToF）3D傳感器。我們採訪了Rene Kromhof（以下簡稱RK）關於Heptagon公司和3D傳感技術近期發展情況。
YD：請您介紹一下Heptagon公司及其產品線？
RK：Heptagon公司始建於1993年，經過20多年的發展，已經從微光學零部件研發和製造逐步發展到具有強大的產品系列組合。Heptagon公司憑藉行業領先的光學、傳感器、電子、軟件以及晶圓級集成技術，能夠提供完整的系統級解決方案，如先進的ToF技術、3D成像、光源及其它多功能傳感器。經過20多年的發展積累，我們現在能將它們整合在一起，並提供高附加值的產品。
2014年我們完成了對Mesa Imaging公司的收購，借助其過去十多年的ToF技術研究成果，我們開發了從單點傳感器到十二點傳感器的完整產品線，包括一款行業首創的多點ToF傳感器。另外，Heptagon公司能提供整合攝像頭、光源、軟件以及解決尖端移動應用需求服務的全方位3D解決方案，如Mora和Zora產品。最後，我們還為ToF技術、自適應3D技術以及結構光提供新穎、小型並且高性價比的紅外光源。公司目前大約有1000名員工，並在最近發布了我們產品出貨量超過20億的新聞。
Mora：3D成像解決方案
YD：Heptagon公司最初因其晶圓級光學技術而聞名，請問你們是如何將這種技術能力轉化為現有產品呢？
RK：我們圍繞自己的核心技術——晶圓級製造工藝，來開發和製造產品，包括微型光學產品和晶圓級光學產品，但更重要的是，憑藉晶圓級集成技術使我們有能力提供完整的系統級解決方案。我們現在為客戶提供的所有產品，從光源、ToF傳感器到3D成像產品，都是使用自己開發的技術或者我們收購企業的技術。
此外，我們憑藉自己的技術方案，還為客戶提供重要的定制化項目，為客戶提供大批量的定制化產品，完全根據客戶要求定制，可以是光學解決方案、特種傳感器等各種各樣的產品。
YD：Heptagon公司剛剛發布了一款新的測距儀，這款產品的商業前景如何？
RK：新產品Trinity和Shilah是行業首創的多點3D測距傳感器，具備最長2米、最高12個獨立測量點的精準距離測量能力。Trinity是行業首創的9個測量點的多點測距傳感器。Shilah可以根據應用需要，動態配置1到12個測量點，使用戶能夠創建可配置的測量點陣列實現諸多高級應用，如場景分析、邊界提取或者先進物體探測。
Trinity：業界首創多點測距傳感器
創新的動態多點重構技術能夠針對具體應用或環境進行配置，以根據不同情況優化分辨率、景深和電池壽命。Shilah和Trinity均是完整的測量系統，包含HeptagonToF傳感器、高性能VCSEL光源、新型光學元件封裝和集成處理器。它們還包含專用的光學元件，使得傳感器可以在視場內以最高12個獨立測量點來獲取距離數據。
我們的單點測距傳感器Laura和Olivia具有廣泛的客戶接受度。我們的首款產品設計獲得了成功，目前正在大批量生產。
YD：您認為攝像頭模組技術及市場將如何發展？
RK：我們預計移動設備中的攝像頭數量將呈增長趨勢，以獲得更好的成像質量，或利用景深傳感系統增加新的功能和應用。但是，移動設備的輕薄設計趨勢使得內部空間越來越緊張，由此帶來的重大挑戰之一就是如何在更狹窄的空間內放入更多的攝像頭。
Heptagon公司開發的產品和技術使我們能夠基於現有的CMOS圖像傳感器和光學元件顯著縮小攝像頭封裝尺寸。我們稱之為對焦控制器封裝（Focus Controller Packaging, FCP），依賴這種佈局構造，相比傳統的基於鏡桶和接環（barrel and mounts）或主動對準（active alignment）模組，我們可以縮小約50%的封裝尺寸。
此外，我們觀察到人機接口技術（HMI）目前還正處於起步階段，Heptagon公司在這一領域有著真正的價值主張。攝像頭模組設計的難點在於將各種不同組件如光學元件、矽以及封裝材料整合在一起，除此之外還需要能開發出功能豐富的軟件。Heptagon公司在上述領域都出類拔萃。我們的自適應立體景深傳感系統就是一個極好的例子。
手機市場趨勢：提升攝像頭模組技術規格，保持市場不斷成長
YD：主要的智能手機應用案例將是什麼？Heptagon技術是如何幫助實現的？
RK：3D景深測距傳感器的主要應用案例是激光探測自動對焦（LDAF），我們認為這是對相位探測自動對焦（PDAF）的完美補充。後者（PDAF）適用於對比度高、明亮環境（如室外），而前者（LDAF）在室內、低對比度、弱光甚至無光環境下性能優於相位探測自動對焦（PDAF）。我們新開發的多點測距傳感器將為自動對焦系統帶來更好的用戶體驗，使用戶能在任何地方快速拍攝照片。
針對前置攝像頭，我們能提供很多應用。先進的生物識別安全系統，如人臉識別和虹膜掃描，這些似乎是最令人關注的應用。其它如人機接口和3D掃描應用的手勢識別、簽名、指紋或掌紋識別，也將推動我們的產品應用。
如前所述，我們能夠利用我們的FCP技術製造非常小的攝像頭模組。由此，我們的攝像頭模組不在受限於光學器件的尺寸。通過除去在光學鏡筒中的螺紋數需求，我們的攝像頭模組尺寸僅受傳感器裸片大小限制。這對空間敏感的智能手機、虛擬現實和增強現實設備製造商來說價值極高。
YD：您認為無人機和機器人市場今後幾年將如何發展？
RK：這是一個令人興奮的市場，我們已經為該市場開發了相應的傳感器。除了上述產品以外，我們還致力於智能家居、智能樓宇和零售解決方案的產品開發。例如我們的Taro，一款小型120 x 80像素3D TOF攝像頭，對動態人員檢測、人數統計和其它零售分析應用非常有用。
Taro：小型120 x 80像素3D ToF攝像頭
YD：Heptagon公司今後的發展計劃如何？
RK：我們對正在開發中的產品感到非常興奮。我們將繼續發展基於ToF技術的產品路線圖。過去的4個月裡，我們發布了5款新的ToF產品，我們還將保持新產品的開發節奏。
我們擴大了新加坡的工廠，因此我們的產能獲得了提升。我們的團隊正在快速成長，最近搬入了位於矽谷聖克拉拉（Santa Clara）的新辦公室，目前正致力於為3D成像產品提供算法、產品定義和應用支持。我們認為3D成像領域會有非常好的前景。在聖克拉拉我們還開放了產品體驗中心，我們的客戶和合作夥伴可以現場親身體驗Heptagon產品、演示和技術。
受訪者簡介：
Rene Kromhof——Heptagon公司銷售和市場部高級副總裁
2007年初加入Heptagon公司，Rene在半導體行業、平板顯示設備和組件行業擔任過很多職位，如產品營銷、項目管理、銷售和重要客戶管理。他曾供職於半導體公司ASML。他是推行世界首創的浸沒式光刻半導體系統的關鍵人物之一，他成功地拓展了該市場，並把業務成功推廣至亞洲、歐洲和美國。他擁有應用物理科學學士學位。
Yole Développement (Yole) has had the opportunity to interview René Kromhof, Senior Vice President Sales and Marketing at Heptagon. Yole has extensively covered imaging markets and technologies in several reports, including “Compact Camera Module Industry 2015” and "Camera Module Industry 2015 Mobile CCM Technology Review" .
Our latest, “Sensors for Drones and Robots 2016" (to be released in March 2016) is in perfect tune with Heptagon’s recent release of 3D time-of-flight sensors. We asked René Kromhof about the company and the recent developments in 3D sensor technologies.
Yole Développement (YD): Can you present Heptagon and its product line up?
René Kromhof (RK): The company was founded in 1993, more than 20 years ago, and has moved incrementally from the development and manufacturing of micro-optics parts to a robust product portfolio. This has enabled Heptagon to deliver complete system solutions like advanced Time-of-Flight (ToF), 3D imaging, illumination and other multi-function sensors based on industry leading optics, sensors, electronics, software and wafer level integration technologies. From the building blocks developed over the last 20 years, we are now able to combine them together and deliver high added-value products.
Based on the acquisition of Mesa Imaging in 2014 and their ToF advancements over past decades, Heptagon has developed a complete line of products from single point to twelve point sensors, including an industry-first multipoint ToF sensor. Additionally, Heptagon provides a full range of 3D solutions that combine cameras, illuminators, software and services that address cutting-edge mobile application requirements, like the MORA and ZORA products. Lastly, we deliver novel, small and cost-effective infrared illuminators for ToF, adaptive stereo as well as structured light.
The company now has roughly 1,000 employees, and has recently announced it has delivered more than two billion products.
YD: Heptagon was initially known for its know-how in wafer level optics, how does this capability translate into its current product offering?
RK: We are developing and manufacturing products that are built around our core technology, which is wafer-level processing. This includes micro-optics and wafer-level optics, but more importantly, it has enabled us to build complete system solutions that are based on wafer-level integration. All the products we are now proposing to our customers, from illumination and ToF sensors to 3D imaging, are using the technologies we have developed and the ones we have acquired.
In addition, we still have important custom projects with customers, alongside our own solutions, in order to provide very specific products in high-volume manufacturing. It can be optical solutions, specific sensors, a variety of products, all based on custom specifications.
YD: Heptagon just released a new rangefinder. What are the business prospects for this product?
RK: The new products, TRINITY and SHILAH, are industry-first multi-point 3DRangers providing accurate distance measurement up to two meters with up to twelve independent points. TRINITY is the industry’s first multipoint ranger with nine points. SHILAH can be configured to dynamically create one to twelve measurement points, depending on the requirements of the application. This gives the user the ability to create a configurable array of measurement points and enables advanced applications like scene analysis, edge extrapolation, or advanced object detection.
The innovative dynamic multi-point reconfiguration technology enables application or context-specific configurations to optimize resolution, depth, and battery life in each circumstance. SHILAH and TRINITY are complete measurement systems that include the Heptagon ToF sensor, high-performance VCSEL illumination, novel optical packaging, and onboard processing. They also include specialized optics that allow the sensor to capture distance data at up to twelve independent points within the field of view (FOV).
Our single point rangers LAURA and OLIVIA have great customer acceptance. We now have our first design wins, and are mass producing them.
YD: How do you think the camera module business will evolve, technically and market-wise?
RK: We foresee a trend towards an increased number of cameras in mobile devices to enrich image quality or to add new features and applications by taking advantage of depth sensing systems. Yet the space constraints are getting tighter and tighter so one of the big challenges is going to be how to fit more cameras into less space.
At Heptagon, we have developed products and technology that enables us to shrink the footprint of cameras significantly, based on available CMOS sensors and optics. We call this Focus Controller Packaging, or FCP, and depending on the configuration, we can shrink footprints by as much as 50% compared to the traditional modules based on barrel and mounts or active alignment.
Additionally, we observe that Human Machine Interfacing (HMI) is in its infancy and at Heptagon we have a real value proposition in this domain. The difficulty of camera module design is to combine heterogeneous components such as optics, silicon, and packaging, and on top of that being able to develop feature rich software. This is exactly where we stand and excel at Heptagon. Our adaptive stereo depth sensing systems are a good example of that.
YD: What will the key smartphone use cases be, and how can Heptagon technology help?
RK: For 3D depth ranging devices, the main use case is Laser Detection Autofocus (LDAF) which we consider to be perfectly complementary to Phase Detect Autofocus (PDAF). The latter works well in contrast-rich, bright environments like outdoors while the former will outperform PDAF for indoor, low contrast, low light, or even no light. Our move to multipoint rangers will further enrich the experience of AF systems, and allows users to quickly snap pictures, anywhere they are.
For the front-facing camera experience, there are multiple applications where we can help. Advanced biometric security, like face recognition and iris scanning, seems to be the most interesting application. Gesture or sign/finger/hand recognition for HMI and 3D scanning are the other applications driving the adoption of our devices.
As mentioned before, we are able to manufacture extremely small camera modules with our FCP technology. With this, the module is no longer limited by the optic’s size. By removing the need of threads in the optical barrel, the camera module dimensions are only limited by the sensor die size. This ability is highly valued by smartphone and Virtual/Augmented Reality (VR) device makers where space is at a premium.
YD: How credible do you think drone and robotic markets will be in years to come?
RK: This is an exciting market, and we have already developed sensors to serve it. Besides those, we are working hard on Smart Home/Building and Retail solutions. Our TARO product, for example, is a compact 120 x 80 pixel 3D ToF camera that is very useful for occupancy detection, people counting and other retail analytics application.
YD: What are the next steps in Heptagon’s development?
RK: We are super excited about the products we have in the pipeline. We will continue to develop our ToF-based roadmap. Over the last four months we have announced five new ToF products, and we will continue our development pace for new products.
We have expanded our Singapore facilities and thus now have even more capacity available. We recently moved to a new office in Santa Clara, in Silicon Valley, and the team there is growing fast, working on algorithms, product definition and application support for our 3D Imaging product offering, for which we see a bright future. Also in Santa Clara we have opened our executive briefing center where customers and partners can come in and see our products, demos and technology in person.
Interviewee:
René Kromhof, Senior Vice President, Sales & Marketing - Heptagon
Prior to joining Heptagon in early 2007, René worked in the semiconductor and flat panel display equipment & component industry holding various positions in product marketing, program management, sales and key account management. Among the companies he worked at was semiconductor company ASML. René has played a key role in introducing the world”s first immersion lithography semiconductor systems and has successfully created and grown businesses throughout Asia, Europe and the US. He holds a bachelor’s of science in applied physics.
Source: www.yole.fr / http://hptg.com
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