SAN FRANCISCO--ON Semiconductor Corp. will close its Aizu, Japan, wafer manufacturing plant by the end of June 2012, to hone in on more advanced technologies, the company said Monday (Oct. 17).
The firm says the facility’s closure falls in line with its strategy of moving smaller volume wafer manufacturing to larger, higher volume fabs, freeing up revenue to invest in next generation fab technology.
The Aizu plant—one of ON Semi’s nine chip fabs—has been the main production house for the company’s 150-mm wafers, which the firm says can now be outsourced to some of the larger 200-mm production facilities. A decision to retool the facility for larger wafers was apparently dismissed.
Keith Jackson, president and CEO of ON Semi said it was “vital to the growth of the company,” that the firm’s manufacturing technologies kept pace with “the advancing needs” of its customers.
ON Semi’s executive vice president and chief operating officer John Nelson added that Aizu would not be the only of ON Semi's nine plants closed, explaining that the move would be followed by consolidation of two Japanese fabs operated by Sanyo Semiconductor, which ON Semi acquired in January.
Despite the consolidation, however, Nelson said ON Semi still expects to increase production capacity in 2013.
The closure of the 21-acre Aizu campus will result in job losses for 197 full time staff members as well as 94 contract jobs, the company said. The restructuring is expected to cost ON Semi between $20 to $25 million in the fourth quarter of 2011 but should ultimately save the firm approximately $8 million per quarter.
In related news, ON Semi also temporarily closed one of its Thailand fabs in the Rojana Industrial Park last week due to the heavy flooding in the region. The facility is said to produce some 5-10 percent of ON Semi’s global output and the firm says the closure could also have an adverse effect on fourth quarter revenues, as well as revenues in 2012.
資料來源:http://www.eetimes.com/electronics-news/4229812/ON-Semi-to-close-Japanese-fab
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