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3D TSV is in MEMS, CMOS Image Sensors and High-End Applications. When will it be used for mainstream consumer applications?

On one side, integration using through silicon vias (TSV) is a technology which is widely adopted in CMOS image sensor and MEMS manufacturing, allowing much smaller foot print.

Toshiba, STMicroelectronics, Bosch, TSMC, mCube… are using such devices in high volume production. The drivers are simple: integrate more functions and use separate wafers in order to process different functions (mainly on one side the sensing elements and on the other side the processing IC).

On the other side, TSV is under development for years in devices like memory higher integration, logic/memory integration, digital device partitioning…. Here also, the drivers are very straight forward but the cost of the technology, the complexity to implement a supply chain, the different technical choices to be done, etc. have limited the technology adaption so far

So what has changed? The first very important point is that the technology and process flow has dramatically been simplified in the last months: there are now only 2 TSV manufacturing options, with clear focus in terms of applications and companies able to use them. Via middle is used by IDM and foundries for memories and logic dies, mainly on 300mm. Via last is used by MEMS companies, OSAT and middle end foundries for more diversified products going into manufacturing.

The second point is linked to a clearer supply chain: now, most of the companies possibly involved in TSV manufacturing know when and where to use it. So the technical choices are now done from design to manufacturing to supply chain implementation.

The third major point is that when 3D is adopted, it will never dropped! It is difficult to adopt 3D because it is a big change in the manufacturing and the way to design devices, but when such adaption is decided, the added value of 3DIC using TSV is so important that no turning back is possible… So when a company will move into production using TSV, all its competitors will do the same.

So what will happen?
In the new report from Yole Développement, “3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update”, we are highlighting the following roadmap of product introduction: Memory will adopt TSV in volume production in 2015 (yes, next year) for high end applications. Then the wide I/O will follow in 2016, here also for high end applications, and finally, logic/logic integration will follow 2 years later.

When will we see memory or logic devices in a mobile phone? It is a matter of cost. TSV is most welcome in many applications linked to mobile phone but the added cost is too high at the moment. So we will have to wait few more years before talking about that. But TSV is there, alive and kicking...

Source: www.yole.fr