在 8 月的時候 Samsung 曾宣佈將開始量產超高速 eMMC 記憶體晶片，而如今採用 10nm 製程的 64GB eMMC Pro Class 2000 行動快閃記憶體晶片就出現在我們面前了。和之前的產品相比其製程從 20nm 改進到了 10nm，晶片體積小了約 20%，而在效能表現和生產力效率方面則有了高達 30% 的提升。幾個月前 Samsung 剛剛推出了使用 JEDEC eMMC 4.5 介面的晶片，現在新品問世，他們下一步的計劃是在明年的時候向 JEDEC 申請全新的介面標準。
據悉這款產品的隨機寫入速度達到了 2,000 IOPS（每秒輸入輸出運轉次數，Input / Output Operations Per Second），隨機讀取速度為 5,000 IOPS，和之前產品 1,500 IOPS / 3,500 IOPS 的成績相比有了很大的進步。而在連續寫入／讀取方面其表現分別為 260MB/s 和 50MB/s。據瞭解這批晶片已於上月投產，再過一段時間應該就能在你身邊的手機或平板上看到它的身影囉。
Samsung Introduces Advanced Memory Storage Solution for Slim Smartphones and Tablets
SEOUL, Korea on Nov. 15. 2012
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced a next-generation 64GB embedded multimedia card (eMMC) using 10 nanometer (nm)-class* process technology. The new 64Gb NAND memory went into production late last month.
Myungho Kim, vice president of Memory marketing, Device Solutions, Samsung Electronics noted, "The new high-speed, small form factor eMMC reinforces Samsung's technology leadership in storage memory solutions. We look forward to expanding our line-up of embedded memory solutions in conjunction with the new chip's design, in pursuing a system-level adoption of application processors and other key components that form the foundation for the most advanced mobile platforms. This will allow us to better attend to time-to-market demands enabling the design of more convenient features for next-generation mobile applications."
Embedded memory is the key memory component in popular mobile applications such as smartphones and tablets. Advanced high-performance, high-density eMMCs allow users to access high-density and high-resolution content such as full HD video on their latest mobile devices and provide a better user experience for web browsing, gaming and running rich applications.
Samsung is applying 64Gb high-performance NAND memory using its10nm-class technology to the new 64GB eMMC Pro Class 2000 memory solution. The new embedded memory solution exceeds the performance levels of the conventional 64GB eMMC Pro Class 1500 based on an eMMC 4.5 interface.
The new high-speed eMMC will be submitted next year to the industry standards body JEDEC, (Joint Electron Engineering Council) for adoption as an industry standard.
Samsung's next-generation 64GB eMMC Pro Class 2000 comes just five months after the company introduced its first embedded memory supporting the eMMC4.5 interface and delivers a 30 percent advantage in performance over that solution.
The 10nm-class technology based NAND also is process compatible to Samsung's advanced 20nm-class* 64Gb MLC NAND, which was first available last May, improving manufacturing productivity by 30 percent.
The new memory solution has a random write speed of 2,000 IOPS (input/output per second) and a random read speed of 5,000 IOPS. In addition, sequential read and write speeds are 260 megabytes per second (MB/s) and 50MB/s respectively, which is up to 10 times faster than a class 10 external memory card that reads at 24MB/s and writes at 12MB/s, greatly enhancing the smoothness of multitasking on mobile gadgets.
Current mobile applications show a distinctive trend to slimmer designs and larger display screens, while using advanced multi-core processors and high density (2 Gigabyte) LPDDR2 memory for higher performance, with larger batteries for longer usage on a single charge. This new chip accommodates the increasing size limitations of mobile form factors at the component level.
The 64GB eMMC Pro Class 2000 measures 11.5mm by 13mm, which represents a 20 percent reduction in size over the conventional embedded memory form factor (12mm by 16mm).
For more information about Samsung memory, visit: www.samsungsemi.com or www.samsung.com/memory
Samsung and the stylized Samsung design are trademarks and service marks of Samsung Electronics Co., Ltd. Other trademarks are the property of their respective owners.
資料來源:http://www.samsung.com/global/business/semiconductor/news-events/press-releases/detail?newsId=12281
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